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Information Session: Scholarships & Career in the Leader of Luxury Packaging, Shenzhen, China

Monday, 14 May 2018   (0 Comments)
Posted by: Thu Do Ha

SHENZHEN, China - May 12, 2018

Representatives from Hinrich Foundation, Knoll Printing & Packaging and Hong Kong Polytechnic University came to Shenzhen in China to hold a coffee talk with Chinese candidates for the Hinrich Global Trade Leader Development Program. 

To help the candidates understand more about packaging industry, Simon Zhang, Production Manager of Knoll Printing & Packaging gave a brief introduction into the industry's growth and trends. 

A nice package is not only appearance but only a selling-point for products. The company is experiencing more than 20% growth in recent years, which posed a great need for talents, especially in project management, engineering etc...

For academic year 2018-2019, Knoll and Hinrich Foundation co-sponsor one full scholarship for MSc in Engineering Business Management (EBM) at HK PolyU (HKPU) plus the career opportunity upon graduation with Knoll. 

 Bai Feng, a current graduate student of the program at HK PolyU came to share his experience with the study and life in Hong Kong. 

Juliette Li, Hinrich current scholar, who was awarded a scholarship co-sponsored by Hinrich Foundation & Knoll Printing & Packaging last year, now currently doing a one year work placement with the company, also shared her journey with the new candidates. 


For further detail for this life-changing opportunity, visit our website

Deadline for application is May 31, 2018. HURRY UP!

To download: 

1. The company's presentation, click here

2. The Hinrich Foundation's presentation, click here

3. The IGDS representative's presentation, click here.

Thuy Ho, Program Coordinator of Hinrich Foundation gave a presentation about the Foundation & its program to interested candidates. 

 Juliette Li, Hinrich scholar, shares about her journey with Knoll Printing & Packaging co-sponsored scholarship. 

Group photo


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